Based on the aggregated intelligence of 180,000-plus investors participating in Motley Fool CAPS, the Fool's free investing community, graphics-chip maker NVIDIA (NASDAQ: NVDA ) has earned a respected four-star ranking.
With that in mind, let's take a closer look at NVIDIA and see what CAPS investors are saying about the stock right now.
NVIDIA facts
Headquarters (founded)
Santa Clara, Calif. (1993)
Market Cap
$8.4 billion
Industry
Semiconductors
Trailing-12-Month Revenue
$4.3 billion
Best Semiconductor Companies To Watch For 2015: Advanced Semiconductor Engineering Inc (ASX)
Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.
The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.
Packaging Services
The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).
The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.
The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.
Testing Services
The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.
The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.
Advisors' Opinion:- [By Namitha Jagadeesh]
The FTSE 100 Index (UKX) fell 1.31 points, less than 0.1 percent, to 6,679.77 at 10:12 a.m. in London, trimming an earlier decline of as much as 0.6 percent. The gauge has climbed 13 percent this year as central banks maintained stimulus measures to support the global economy. The broader FTSE All-Share Index (ASX) was also little changed today, while Ireland�� ISEQ Index retreated 0.3 percent.
- [By Adam Haigh]
ASX Ltd. (ASX) posted the biggest weekly loss in 3 1/2 years, falling 6.1 percent to A$33.15, amid a A$553 million ($530 million) capital raising at the operator of Australia�� main stock exchange to ensure its clearing business complies with new regulations.
- [By Seth Jayson]
Advanced Semiconductor Engineering (NYSE: ASX ) is expected to report Q2 earnings around July 7. Here's what Wall Street wants to see:
- [By Jeff Reeves]
Next Page
Best Stocks to Buy for Around $5: Advanced Semiconductor Engineering (ASX)Advanced Semiconductor Engineering�(ASX) builds and distributes integrated circuits and other electronics. While that�� not as sexy as other chipmakers that play to mobile, it�� still a good business, considering the general demand for microchips in everything from cars to computers to TVs.
Best Semiconductor Companies To Watch For 2015: M/A-COM Technology Solutions Holdings Inc (MTSI)
M/A-COM Technology Solutions Holdings, Inc. (M/A-COM), incorporated on March 25, 2009, is a provider of high-performance analog semiconductor solutions for uses in wireless and wireline applications across the radio frequency (RF), microwave and millimeter wave spectrum. The Company manages has one segment, which is semiconductors. The Company offers over 2,700 standard and custom devices, which includes integrated circuits (IC), multi-chip modules, power pallets and transistors, diodes, switches and switch limiters, passive and active components and complete subsystems, across 37 product lines serving over 6,000 end customers in four primary markets. The Company's semiconductor products are electronic components that the Company's customers incorporate into their larger electronic systems, such as point-to-point wireless backhaul radios, radar, automobile navigation systems, digital cable television (CATV) set-top boxes, magnetic resonance imaging systems and unmanned aerial vehicles. In February 2014, M/A-COM Technology Solutions Holdings Inc announced that its subsidiary Mindspeed Technologies Inc completed the sale of assets of its wireless infrastructure business unit to Intel Corporation.
The Company's primary markets are Networks, which includes CATV, cellular backhaul, cellular infrastructure and fiber optic applications; Aerospace and Defense (A&D); Automotive, which includes global positioning system (GPS) modules sold to the automotive industry; and Multi-market, which includes industrial, medical, mobile communications and scientific applications. The Company operates a single Gallium Arsenide (GaAs) and silicon semiconductor fab at its Lowell, Massachusetts headquarters, which the Company is in the process of updating to include Gallium Nitride (GaN) fabrication operations as well. The Company also utilizes external semiconductor foundries to supply the Company with additional capacity in periods of high demand and to provide the Company access to additional process technolog! ies. The ability to utilize a broad array of internal process technologies as well as commercially available foundry technologies allows the Company to select the appropriate technology to solve the Company's customers' needs.
The Company offers high-performance analog semiconductor products for both wireless and wireline applications across the frequency spectrum from RF to millimeterwave. The Company regularly develops high-value products to serve its customers in four primary markets: Networks, A&D, Multi-market and Automotives.
Aerospace & Defense
In the A&D market, military applications require more advanced electronic systems, such as radar warning receivers, communications data links and tactical radios, unmanned aerial vehicles (UAVs), RF jammers, electronic countermeasures and smart munitions. Military applications are becoming more sophisticated, favoring higher performance semiconductor ICs based on GaAs and GaN technology due to their high power density, improved power efficiency and broadband capability. Radar systems for mapping and targeting missions are undergoing a transition from existing mechanically-scanned radar products to a new generation of active electronically-scanned array (AESA) based products. Consisting of hundreds or thousands of transmit/receive modules commonly based on GaAs and increasingly on GaN technology, AESAs deliver greater speed, range, resolution and reliability over mechanically-scanned radar products that utilize a single transmitter and receiver with mechanical steering. Military communications employing wireless infrastructure and tactical radios in the field remain critical for allowing geographically dispersed users to exchange information quickly and efficiently. UAVs and their underlying semiconductor content requires designs to meet rigorous specifications for high performance, small size, and low power consumption.
Automotive
The Automotive category includes GPS modules the Company sel! ls to the! automotive industry. Semiconductor content in automobiles is projected to grow in order to offer connectivity, safety, performance and navigation features.
Multi-market
In Multi-market, the Company's products are used in industrial, medical, mobile communications, test and measurement and scientific applications. In the medical industry, the Company's custom designed non-magnetic diode product line is a critical component for certain MRI applications. The Company offers a broad range of standard and custom ICs, modules and complete subsystems across 37 product lines. The Company's product portfolio consists of more than 2,700 products including the key product platforms: power pallets and transistors, ICs, diodes, switches and switch limiters, passive and active components, multi-chip modules, and complete subsystems. Many of the Company's product platforms are leveraged across multiple markets and applications. For example, the Company's applications with regard to power transistor technology is leveraged across both scientific laboratory equipment applications and commercial and defense radar system applications. The Company's diode technology is used in switch filter banks of military tactical radios as well as medical imaging MRI systems.
The Company competes with Hittite Microwave Corporation, Sumitomo Electric Device Innovations, Inc., RF Micro Devices, Inc. (RFMD), Avago, Inc. (Avago), Aeroflex, Inc. (Aeroflex), Microsemi Corporation (Microsemi), TriQuint and Skyworks Solutions, Inc.
Advisors' Opinion:- [By Seth Jayson]
M/A-Com Technology Solutions Holdings (Nasdaq: MTSI ) reported earnings on April 30. Here are the numbers you need to know.
The 10-second takeaway
For the quarter ended March 29 (Q2), M/A-Com Technology Solutions Holdings met expectations on revenues and beat expectations on earnings per share. - [By Lauren Pollock]
M/A-COM Technology Solutions Holdings Inc.(MTSI) agreed to acquire semiconductor manufacturer Mindspeed Technologies Inc.(MSPD) in a deal valued at $272 million, expanding the company’s markets to include enterprise applications. Mindspeed shares surged 70% to $5.04 premarket.
Top High Dividend Companies To Own For 2015: Aeroflex Holding Corp (ARX)
Aeroflex Holding Corp. (Aeroflex Holding) is a provider of radio frequency (RF) and microwave integrated circuits, components and systems used in the design, development and maintenance of wireless communication systems. The Company�� solutions include microelectronic components and test and measurement equipment used by companies in the space, avionics and defense; commercial wireless communications, and medical and other markets. Its products include a range of RF, microwave and millimeter wave microelectronic components, integrated circuits (ICs), and analog and mixed-signal devices. It also manufactures a range of RF and microwave wireless radio and avionics test equipment and solutions particularly for the wireless, avionics and radio test markets. The Company operates in two segments: Aeroflex Microelectronics Solutions (AMS) and Aeroflex Test Solutions (ATS). In August 2010, it acquired Advanced Control Components. In September 2013, the Company announced the sale of its Aeroflex Test Equipment Services (ATES) business to Trescal Limited. In February 2014, Aeroflex Holding Corp announced the acquisition of Shenick Network Systems.
Aeroflex Microelectronic Solutions
AMS offers a range of microelectronics products and is a provider of specialty products for the space, avionics, defense, commercial wireless communications, medical and other markets. RadHard products are specifically designed to tolerate high radiation level environments, which otherwise can degrade electronic components. The Company principally operates on a fabless semiconductor manufacturing model, outsourcing virtually all front-end semiconductor fabrication activities to commercial foundries. AMS offers a range of complementary products that provide connectivity and computing functionality for applications. Its product portfolio includes RF, microwave and millimeter wave products, including discrete components, ICs, monolithic microwave ICs and multi-chip modules.
AMS designs and manu! factures application specific, analog and mixed-signal devices for use in medical, industrial and intelligent sensors. The Company�� AMS products are used in over 100 space, avionics and defense platforms, including the Wideband Global Satellite Communications satellites, the Geostationary Operational Environmental satellites, the Advanced Extremely High Frequency satellites, the Boeing 777 airliner's databus, the F-16's modular mission computer, the B-1 flight controls upgrade and the Terminal High Altitude Area Defense program. Its AMS products are also used in wireless communications platforms, including WCDMA and LTE cellular base station systems, as well as point-to-point broadband radio applications. In the medical area, our products are used by two of the top four manufacturers of CT scan equipment.
AMS provides HiRel standard and custom integrated circuits and circuit card assembly for the aerospace, altitude avionics, medical, x-ray cargo scanners, critical transportation systems, nuclear power controls, global positioning systems (GPS) receivers, networking and telecommunication markets. AMS' HiRel products include transceivers, analog multiplexers, clock management generators, MSI logic products, battery electronics units, voltage regulators, high-speed power controllers, MIL-STD 1553 bus controllers, remote terminals, bus monitors, microcontrollers and microprocessors, RadHard Pulse Width Modulation Controllers, RadHard Resolver-to-Digital and memory modules. HiRel Microelectronics/ Semiconductors have a typical life cycle of 10-20 years.
AMS provides a set of standard and application specific RF/microwave diodes and semiconductor devices. Microwave semiconductor products offered include diodes, amplifiers, resistors, inductors, capacitors, switches, and integrated devices. RF and Microwave active components and subsystems offered include PIN diode-based microwave control components, variable attenuators, phase shifters, limiters, time delay units and Multi-Funct! ion Micro! wave assemblies. AMS offers resistor products, which include a variety of low and high reliability power surface mounted passive devices for the wireless infrastructure and defense markets with applications in isolators, circulators, single and multi-carrier power amplifiers and circuits. Passive components offered include attenuators, terminations, adapters, DC blocks, and other components for commercial, military and laboratory applications. Other products include power amplifiers, up and down converters, mixers, filters and micro-receivers operating to over 40 giga hertz (GHz). RF and Microwave components have a typical life cycle of 5-15 years. The Company�� motion control products provide complete and integrated motion control solutions for space (both military and commercial), military, avionics, and industrial customers. Its product line offerings include actuators and mechanisms, electronic controllers, slip rings and twist capsules, DC motors and Gimbal Systems. Motion control products have a typical life cycle of 10-20 years.
Aeroflex Test Solutions
ATS is a provider of a line of specialized test and measurement hardware and software products, primarily for the space, avionics, defense, commercial wireless communications and other markets. ATS products and their applications include wireless test equipment, which is used to develop and test handsets and base stations; military radio and PMR test equipment, which is used by radio manufacturers and military, police, fire, and emergency response units to test handheld radios; avionics test equipment, which is used in the design, manufacture and maintenance of electronics systems for aircraft; synthetic test equipment, which is used to test satellites and transmit / receive modules prior to launch and deployment, and general purpose test equipment, including spectrum analyzers and signal generators.
Wireless Test Equipment is used by wireless service providers and equipment manufacturers to test wireless ! handsets ! and base stations. The Company offers a range of cellular tests across a range of wireless standards and communication frequencies, including 2G and 3G, with particular capability in EDGE protocols, and the new 4G LTE/LTE(A) protocols. Products include a range of system, protocol, physical layer and parametric test solutions, such as the TM500 test mobile, RF synthesizers, digitizers and combiners, and application software. In addition, ATS provides PXI-based products which are modular scalable solutions for the handset manufacturing environment. Product applications include research and development, conformance, manufacturing/production, installation and commissioning, field service, and network optimization.
ATS Radio Test Equipment is used by radio manufacturers and military, police, fire and emergency response units to test handheld radio units. ATS provides TErrestrial Trunked Radio (TETRA), and Project 25 (P25), radio test equipment, addressing both mobile and repeater test applications. TETRA is a global standard for private mobile radio (PMR), systems used by emergency services, public transport and utilities. P25 is a standard for digital radio communications for use by federal, state, private, and local public safety agencies in North America. Its military communications testing systems are primarily used by the United States military to test complex voice and data frequency hopping radios and accessories. Military radio and PMR test equipment has a typical life cycle of 5-20 years.
Avionics test equipment is used in the design, manufacture, test and maintenance of commercial, civil and military airborne electronic systems, or avionics. ATS equipment provides the stimulus and signals necessary for certification, verification, fault finding and diagnosis of airborne systems on the ground. For civil and commercial aviation, it has test solutions for various transponder modes, communications frequencies, emergency locator transmitters, weather radars and GPS systems. F! or milita! ry aviation, it has test solutions for microwave landing systems, tactical air navigation, enhanced traffic alert and collision avoidance systems, various identification friend or foe, or IFF, transponder/interrogator modes and IFF monopulse antenna simulation. ATS also provides customized avionics test solutions to support manual and automatic test equipment for manufacturing, repair and ground support operations. Avionics test equipment has a typical life cycle of 8-15 years.
Synthetic test systems test several attributes through one box and can take multiple complex measurements simultaneously. ATS provides synthetic test environment that allows digital, analog, RF/microwave and power test of circuits, modules, subsystems and complete systems for commercial, military, and aerospace customers. ATS' STI 1000C+ and TRM 1000C products offer synthetic microwave test systems optimized for testing Transmit/Receive modules and satellite payloads in a factory setting. Its SMART^E and SMART^E 5300 products offer a modular approach for implementing multi-function configurable and reconfigurable test systems. Synthetic test solutions products have a typical life cycle of 10-15 years.
ATS offers a variety of general purpose test solutions including microwave test solutions, counters and power meters. ATS microwave test solutions cover frequency ranges from 1 megahertz (MHz) to 46 gigahertz (GHz), with various tracking, offset, continuous wave, modulated source, fault location, and group delay configuration options provided. ATS power meters are designed for field use, automated test equipment requirements and standard bench applications. General purpose test solutions have a typical life cycle of 4-7 years.
The Company Competes with Agilent Technologies, Honeywell, BAE Systems, Hittite Microwave Corporation, ILC / Data Devices Corporation, Microsemi, Anaren, Anite, Anritsu, Rohde & Schwarz, Spirent and National Instruments.
Advisors' Opinion:- [By Rich Smith]
The Department of Defense issued some 22 separate contract awards Thursday, totaling just under $1 billion in combined value. Not all of them went to publicly traded defense contractors, of course, but enough of them did to be worth mentioning. Here are a few of the lucky winners:
Best Semiconductor Companies To Watch For 2015: Camtek Ltd (CAMT)
Camtek Ltd. (Camtek), incorporated in 1987, designs, develops, manufactures and markets automated solutions dedicated for enhancing production processes and yield for the semiconductor manufacturing and packaging and the printed circuit board (PCB) and integrated circuit (IC) substrate industries. Camtek also designs, develops, manufactures and markets automated optical inspection (AOI), systems and related products. The Company�� AOI systems are used to enhance both production processes and yields for manufacturers in the semiconductor manufacturing and packaging industry and PCB and IC Substrate industry. Through the acquisition of Printar's assets, it also engaged in developing, manufacturing, sale and marketing of direct digital material deposition systems and inks for the PCB industry, with two major fields of activity: Solder Mask and Legend. In addition, through the acquisition of Sela, it is also engaged in the development, manufacturing and marketing of automated scanning electron microscope (SEM) and transmission electron microscope (TEM) sample preparation equipment, primarily for the semiconductor industry.
As of December 31, 2011, the Company had sold more than 2,500 AOI systems in 34 countries worldwide. The Company's PCB customer base includes the majority of the 100 PCB manufacturers worldwide. As of December 31, 2011, it had sold over 300 Falcon systems to more than 25 semiconductor manufacturers, among them outsourced semiconductor assembly and test (OSAT), integrated device manufacturers (IDM) and wafer level packaging subcontractors, including eight out of the top 10 semiconductors companies.
Camtek�� AOI systems consist of an electro-optical assembly unit, either movable or fixed, which consists of a video camera, precision optics and illumination sources. The electro-optical unit captures the image of the inspected product; a precise, either movable or fixed table, that holds the inspected product, and an electronic hardware unit, which operates the! entire system and includes embedded components that process and analyze the captured image by using its algorithms. Its systems can also compile and communicate statistical reports of inspection findings through the customer�� factory information system. The Company offers a range of systems for automated optical inspection of semiconductor wafers, IC substrates and PCBs. These systems are used to enhance production yields and assist in controlling manufacturing processes at wafer fabrication, test and assembly houses, and PCB plants worldwide.
The Company�� Falcon systems are designed for the back end market of the semiconductor industry. The Falcon�� advanced algorithms and inspection capabilities enable its dedicated models to detect defects in the die, which, if left undetected, may cause failure. The Condor is designed to meet the current and future inspection needs of the semiconductor industry. The Condor, through algorithms and advanced hardware configuration, is designed to enhance two dimensional (2D) and three dimensional (3D) detection abilities and increased throughput. The Condor family includes models for: 3D and 2D metrology and inspection of bumped-wafer prepared for packaging in the flip-chip technology; 2D metrology and inspection of finished wafers at the end of their manufacturing process and in test houses; Post-dicing inspection of frame-mounted wafers at assembly and packaging facilities, where it adds the value of detecting dicing-related damage, and inspection and metrology of micro-electro mechanical systems (MEMS) and other special applications.
Condor 5LED is an AOI system designed to provide solutions to a range of requirements that are to light emitting diode (LED) semiconductor manufacturers. The LED market�� special inspection requirements are characterized by 3-6 inch wafers, each of which may contain between 100 to over 200 thousand LED devices per wafer. Typically, the wafer is made of a translucent compound semiconductor, such as g! allium ar! senide, gallium phosphide and/or indium phosphide. The Gannet system is designed for the front end market of the semiconductor industry.
The Company�� AOI products for this industry consist of five product lines: the Phoenix, Dragon and Orion for the inspection of inner and outer layers of PCB panels and ultra-fine-line IC substrate; large area masks (LAM) dedicated for inspection of artwork; and the Pegasus for final inspection (AFI) of IC substrates and high density interconnect (HDI) panels. The Phoenix product family, introduced in November 2011, is designed to support a range of the demanding PCB and IC substrate applications, while keeping in pace with the dynamic technology changes in the industry. The Phoenix product family is enhanced with Spark - Camtek's and detection engine providing high detection capabilities, while minimizing false calls.
Dragon systems are high-throughput, automation-ready systems for inspection of all PCB types in a mass production environment. Dragon models are optimized for specific PCB technology ranges - from mainstream circuits of typically 100 (microns) conductor line width, up to high density substrates having 12 (microns) wide conductive lines. All Dragon models are designed to interface with automated material handling mechanisms provided by the Company or other automation suppliers. Orion systems are stand-alone AOI systems for high volume inspection of all PCB types designed to operate in inspectify mode of operation. Inspectify is a mode of operation enabling the operator to perform verification immediately after inspection on the same system, thus saving time and eliminating handling-related defects.
LAM is specially designed for main-stream LAM inspection. It offers unparalleled detection ability on LAM with down to 25 (microns) line/space width technology. The LAM incorporates advanced technology innovations to ensure the level of detection that these masks require at this critical production stage. Camtek offers! various ! stand-alone verification systems that enable verification of panels after inspection. The Pegasus line includes systems for automated inspection of finished IC substrates that are subsequently used in packaging of ball grid array (BGA) and Chip Scale Package (CSP) devices. The Pegasus inspects both sides of the substrate, detecting process and mechanical defects, in particular in the gold-plated areas, where the substrate will interconnect with the silicon die or the PCB, and in the solder-mask areas. Pegasus models handle substrates in strip format in magazines.
GreenJet is a SM digital printing system aimed to replace the conventional SM application lines for prototypes and high mix low volume production. The GreenJet system offers manufacturers flexible and digital SM printing technology solution. The LGP system incorporates PCB digital legend printing technologies with specially developed heat curable ink, resulting in output and system performance. Camtek has developed the inks for both LGP and GreenJet, which involves different chemicals mixed together in order to reach the required ink characterization.
The Company competes with Rudolph Technologies Inc., KLA-Tencor Corporation, Topcon Corporation, Toray Industries, Inc., Hitachi Ltd., Nidec Tosok Corporation., FEI Company, SII Nanotechnology Japan, Carl Zeiss, Inc., Orbotech Ltd., Dainippon Screen Manufacturing Company, Lloyd-Doyle Limited, Gigavis Co. Ltd., ATI Electronics Pty Ltd., Shirai Electronics Industrial Co. Ltd., First EIE SA and MicroCraft K.K.
Advisors' Opinion:- [By James E. Brumley]
Investors who've made a point of keeping tabs on the 3D printing craze this year will know that a pair of small caps in this space - Camtek LTD (NASDAQ:CAMT) and Voxeljet AG (NYSE:VJET) - have dominated the headlines in just the past few weeks. For CAMT, the big news was the recent announcement that it would be the first 3D printer maker to develop a product that could print circuit boards. As for VJET, news that it was going to greatly expand its on-demand-printing capacity (for customers that need smaller occasional jobs but don't want to buy a printer of their own) lit the stock up quite nicely.
- [By James E. Brumley]
In retrospect, their pullbacks come as no real surprise. Neither Voxeljet AG (NYSE:VJET) nor Camtek LTD. (NASDAQ:CAMT) saw their shares soar on any news that was meaningfully sustainable, and after the "shoot first, ask questions later" market had a chance to start asking questions, it became clear that - even with the largest of glimmers of corporate progress unveiled a few weeks ago - CAMT and VJET both had been bid up more on hype and less on substance. Meanwhile (and this could be bitterly ironic to some), a small cap play in the same 3D printing space that (1) didn't beat the daylights out of its hype-drum, and (2) is actually much closer to bringing a revenue-bearing product to the market [per today's news - more on that below] isn't getting anywhere near the same attention. That company? Makism 3D Corp. (OTCBB:MDDD). The good news is, MDDD finally looks like it's revving its engine, while Camtek and Voxeljet AG shares continue to deteriorate.
- [By Paul Ausick]
Shares of tech industry testing and inspection systems maker Camtek Ltd. (NASDAQ: CAMT) closed at $1.89 on November 7th, the day the company announced third-quarter earnings. It closed at $2.65 last Friday and skyrocketed to a high of $6.43 on Tuesday before dropping back to around $4.00 in Wednesday trading.
- [By John Emerson]
As noted previously, I rode the elevator up and then back down on Camtek (CAMT), a tiny Israeli automated optical inspection (AOI) company. By late 2008 the company had fallen to below $1 per share. Both of Camtek�� larger rivals, RTEC and ORBK, had dropped to absurdly low levels by November 2008. I used the opportunity to switch out of CAMT and some of my other losing propositions in favor of these superior companies. In the process, I created a large amount of tax loss carry-forwards which would allow me to minimize my future taxation when I decided to sell these cyclical entities.
Best Semiconductor Companies To Watch For 2015: Aixtron SE (AIXG)
AIXTRON SE (AIXTRON), formerly AIXTRON AG, incorporated in 1983, is a provider of deposition equipment equipment to the semiconductor and compound-semiconductor industry. The Company's technology solutions are used by a diverse range of customers worldwide to build advanced components for electronic and opto-electronic applications based on compound, silicon, or organic semiconductor materials. Such components are used in fiber optic communication systems, wireless and mobile telephony applications, optical and electronic storage devices, computing, signaling and lighting, displays, as well as a range of other technologies. AIXTRON's business activities include developing, producing and installing equipment for coating semiconductor materials, process engineering, consulting and training, including ongoing customer support. AIXTRON supplies to customers both full production-scale complex material deposition systems and small scale systems for research and development (R&D) use and small-scale production use.
AIXTRON's product range includes customized production and research scale compound semiconductor systems capable of depositing material films on up to 95 * two-inch diameter wafers per single production run, or smaller multiples of larger diameter wafers, employing MOCVD or Hydride Vapor Phase Epitaxy (HVPE) or organic thin film deposition on up to Gen. 3.5 substrates, including Polymer Vapor Phase Deposition (PVPD) or Organic Vapor Phase Deposition (OVPD) or large area deposition for Organic Light Emitting Diodes (OLED) applications or Plasma Enhanced Chemical Vapor Phase Deposition (PECVD) for depositing complex Carbon Nanostructures (Carbon Nanotubes, Nanowires or Graphene). AIXTRON also manufactures full production and research scale deposition systems for silicon semiconductor applications capable of depositing material films on wafers of up to 300 millimeters diameter, employing technologies, such as Chemical Vapor Deposition (CVD), Atomic Vapor Deposition (AVD) and Atomic Layer! Deposition (ALD).
AIXTRON also offers a range of peripheral equipment and services, including products capable of monitoring the concentration of gases in the air and for cleaning the exhaust gas from metal organic chemical vapor deposition processes. The Company also assists its customers in designing the production layouts for the gas supply to thin film deposition systems. Additionally, the Company offers its customers training, consulting and support services.
The Company competes with Veeco Instruments Inc. (USA), Taiyo Nippon Sanso (Japan), Ulvac, Inc. (Japan), Tokki Corporation (Japan), Sumitomo (Japan), Applied Materials, Inc. (USA), Doosan DND Co., Ltd. (South Korea), Sunic System (South Korea), Tokyo Electron Ltd. (Japan), ASM International N.V. (Netherlands), IPS Technology (South Korea), Jusung Engineering Co. Ltd. (South Korea), and Hitachi Kokusai Electric Co. Inc. (Japan).
Advisors' Opinion:- [By Jon C. Ogg]
Aixtron SE (NASDAQ: AIXG) was downgraded to Sell from Hold at Canaccord Genuity.
Buffalo Wild Wings Inc. (NASDAQ: BWLD) was downgraded to Outperform from Strong Buy at Raymond James.
- [By Rich Smith]
This series, brought to you by Yahoo! Finance, looks at which upgrades and downgrades make sense and which ones investors should act on. Today, our headlines include upgrades for both industrialist Aixtron (NASDAQ: AIXG ) and fashionista bebe stores (NASDAQ: BEBE ) . But the news isn't all good, so let's start off with a few words on...
Best Semiconductor Companies To Watch For 2015: ARM Holdings PLC (ARMH)
ARM Holdings plc (ARM), incorporated on October 16, 1990, designs microprocessors, physical intellectual property (IP) and related technology and software, and sells development tools. As of December 31, 2012, the Company operated in three business segments: the Processor Division (PD), the Physical IP Division (PIPD) and the System Design Division (SDD). ARM licenses and sells its technology and products to international electronics companies, which in turn manufacture, markets and sells microprocessors, application-specific integrated circuits (ASICs) and application-specific standard processors (ASSPs) based on ARM�� technology to systems companies for incorporation into a range of end products. It also licenses and sells development tools directly to systems companies and provides support services to its licensees, systems companies and other systems designers.
ARM processor architecture and physical IP is used in embedded microprocessor applications, including cellular phones, digital televisions, mobile computers and personal computer peripherals, smart cards and microcontrollers. ARM�� principal geographic markets are Europe, the United States and Asia Pacific. ARM�� product offering includes microprocessor Cores: RISC microprocessor cores, including specific functions, such as video and graphics IP and on-chip fabric IP; embedded software; physical IP; development tools, and support and maintenance services.
Processor Division
The PD encompasses those resources that are centered on microprocessor cores, including specific functions, such as graphics IP, fabric IP, embedded software IP and configurable digital signal processing (DSP) IP. Service revenues consist of design consulting services and revenues from support, maintenance and training.
Physical IP Division
The PIPD is focused on building blocks for translation of a circuit design into actual silicon. During the year ended December 31, 2012, the Company�� total av! erage PIPD headcount was 557. ARM is a provider of physical IP components for the design and manufacture of integrated circuits, including systems-on-chip (SoCs). ARM Artisan physical IP products include embedded memory, standard cell and input/output components. Artisan physical IP also includes a limited portfolio of analog and mixed-signal products. ARM�� physical IP components are developed for a range of process geometries ranging from 20 nanometer - 250 nanometer. ARM licenses its products to customers for the design and manufacture of integrated circuits used in complex, high-volume applications, such as portable computing devices, communication systems, cellular phones, microcontrollers, consumer multimedia products, automotive electronics, personal computers and workstations and many others.
ARM�� embedded memory components include random access memories, read only memories and register files. These memories are provided in the form of a configurable memory compiler, which allows the customer to generate the appropriate configuration for the given application. ARM�� memory components include many configurable features, such as power-down modes, low-voltage data retention and fully static operation, as well as different transistor options to trade off performance and power. In addition, ARM�� memory components include built-in test interfaces that support the industry test methodologies and tools. ARM memory components also offer redundant storage elements.
ARM�� memory components are designed to enable the chip designer maximum flexibility to achieve the optimum power, performance, and density trade-off. ARM offers standard cell components that are optimized for high performance, high density or ultra high density. ARM logic products deliver optimal performance, power and area when building ARM Processors, Graphics, Video and Fabric IP along with general SoC subsystem implementation. ARM delivers physical interface for a range of DDR SDRAM (double-data rate s! ynchronou! s dynamic random-access memory) applications ranging from mission critical applications to low-power memory sub-systems. Silicon on Insulator (SOI) products is an alternative methodology to traditional semiconductor fabrication techniques.
System Design Division
The SDD is focused on the tools and models used to create and debug software and system-on-chip (SoC) designs. ARM�� software development tools help a software design engineer deliver products right the first time. Engineers use these tools in the design and deployment of code, from applications running on open operating systems right through to low-level firmware. The ARM Development Studio is a hardware components that allow the software designer to connect to a real target system and control the system for the purposes of finding errors in the software. The ARM DSTREAM unit allows the software developer to control the software running on the prototype product and examine the internal state of the prototype product. ARM Development Boards are ideal systems for prototyping ARM-based products. The ARM Microcontroller Development Kit supports ARM-based microcontrollers and 8051-based microcontrollers from companies, such as Analog Devices, Atmel, Freescale, Fujitsu, NXP, Samsung, Sharp, STMicroelectronics, Texas Instruments and Toshiba. The ARM Microcontroller Development Kit is used by developers who are building products and writing software using standard off-the-shelf microcontrollers.
The ARM Microprocessor Families
ARM architecture processors offers a range of performance options in the ARM7 family, ARM9 family, ARM11 family, ARM Cortex family and ARM SecurCore family. The ARM architecture gives systems designers a choice of processor cores at different performance/price points. The ARM7 offers 32-bit architecture capable of operating from 8/16-bit memory on an 8/16-bit bus through the implementation of the Thumb instruction set. The ARM9 family consists of a range of microprocessors in ! the 150-2! 50MHz range. Each processor has been designed for a specific application or function, such as an application processor for a feature phone or running a wireless fidelity (WiFi) protocol stack. The ARM9 family consists of a range of microprocessors in the 150-250 megahertz range. The ARM11 family consists of a range of microprocessors in the 300-600 megahertz range. ARM Cortex family is ARM�� family of processor cores based on version 7 of the ARM Architecture. The family is split into three series: A Series, A Series and M Series.
Advisors' Opinion:- [By Kofi Bofah]
In his May 14, 2013 interview with Fortune Magazine, ARM (ARMH) CEO Simon Segars mocked the personal computer market as a place "where two people have controlled it and the person that makes PCs runs on 2% profit margin and can't afford to innovate anything other than which shade of grey the plastic is." At the time, Segars' ridicule of the personal computer industry came against a Company Overview backdrop of claims that ARM architecture has been installed within more than 95% of the world's mobile phones. Over the past 24 months, of course, Microsoft (MSFT) and Intel (INTC) have expressed their financial and ideological commitment to building out mobile businesses. The moves out of Segars' "two people," however, have increasingly reeked of desperation. For once, Microsoft and Intel are finding themselves largely shut out and unable to bully their way into a lucrative market.
- [By Steve Heller]
For Intel to remain relevant in the world of mobile computing, it needs to deliver a highly efficient yet powerful mobile computing solution that outperforms the sea of ARM Holdings (NASDAQ: ARMH ) designs. Moreover, it should probably get used to the fact that it won't be able to command the premiums it's grown accustomed to in the PC world.
- [By Royston Wild]
I am currently looking at the dividend prospects of�ARM Holdings� (LSE: ARM ) (NASDAQ: ARMH ) and assessing whether the company is an appetizing pick for income investors.
Best Semiconductor Companies To Watch For 2015: Advanced Photonix Inc (API)
Advanced Photonix, Inc. (API), incorporated in June 22, 1988, is engaged in the development and manufacture of optoelectronic devices and value-added sub-systems and systems. The Company serves a variety of global original equipment manufacturers (OEMs) in a variety of industries. API supports its customers from the initial concept and design phase of the product, through testing to full-scale production. API has two manufacturing facilities located in Camarillo, California and Ann Arbor, Michigan. API is a supplier of optoelectronic semiconductors packaged into high-speed optical receivers, custom optoelectronic subsystems and Terahertz instrumentation, serving a variety of global OEM markets. API supports the customer from the initial concept and design of the semiconductor, hybridization of support electronics, packaging and signal conditioning or processing from prototype through full-scale production and validation testing. The target markets served by it are industrial sensing/NDT, military/aerospace, telecom, medical and homeland security. On March 1, 2013, it acquired certain assets of Silonex, Inc.
The Company�� high-speed optical receivers include avalanche photodiode (APD) technology and positive-intrinsic-negative (PIN) photodiode technology based upon III-V materials, including InP, InAlAs, and GaAs. Its optoelectronic subsystems are based on its silicon large area avalanche photodiode (LAAPD), PIN photodiode, FILTRODE detectors and light emitting diode (LED) assemblies. API�� Terahertz sensor product line is targeted at the industrial homeland security and military markets. Using its fiber coupled technology and high speed Terahertz generation and detection sensors, the Company is engaged in transferring Terahertz technology from the laboratory to the factory floor for use in non-destructive testing and real time quality control.
The Company competes with First Sensor, Illinois Tool Works, JDS Uniphase, Neophotonix, U2T and Nippon Electric.
Advisors' Opinion:- [By Bryan Murphy]
When most investors think of optical sensor makers, they tend to think of larger names like Honeywell International Inc.� (NYSE:HON) or Vishay Intertechnology (NYSE:VSH). And well they should. VSH is a $2 billion company, and HON is a $71.5 billion organization. The fact is, however, there are a few small cap stocks in the optical sensor space that are worth a look, and one of them is worth a very close look right now for a very clear reason... Advanced Photonix, Inc. (NYSEMKT:API).
- [By Patricio Kehoe]
In 2010, the company acquired privately held Nimsoft, a provider of IT performance monitoring solutions for $350 million in cash. In Sep 2010, CA signed a definitive agreement to acquire Hyperformix Inc. Recently; it acquired Layer 7 Technologies, a leading provider of Application Programming Interface (API) security and management. Furthermore, the acquisition of Arcot Systems Inc., a privately held company that provides authentication and fraud prevention software, in a move to boost its security offerings. These acquisitions have helped the firm to strengthen its cloud computing infrastructure and would also help to generate better profitability from the existing technology assets.
Best Semiconductor Companies To Watch For 2015: Sunedison Inc (SUNE)
SunEdison Inc, formerly MEMC Electronic Materials, Inc., incorporated on October 1, 1984, is engaged in the development, manufacture and sale of silicon wafers. The Company is a developer and seller of photovoltaic energy solutions. Through Solar Materials and Solar Energy (SunEdison), it is a developer of solar energy projects. The Company operates in two segments: semiconductor materials and solar energy. The Company�� Solar Energy segment includes the operations of its old Solar Materials segment, as well as its SunEdison business. In the Semiconductor Materials, the Company offers wafers with a variety of features. The Company�� wafers vary in size, surface features, composition, purity levels, crystal properties and electrical properties.
Semiconductor Materials
The Company�� monocrystalline wafers for use in semiconductor applications range in size from 100 millimeter to 300 millimeter and are round in shape for semiconductor customers because of the nature of their processing equipment. Its wafers are used as the starting material for the manufacture of various types of semiconductor devices, including microprocessor, memory, logic and power devices. In turn, these semiconductor devices are used in computers, cellular phones and other mobile electronic devices, automobiles and other consumer and industrial products. Its monocrystalline wafers for semiconductor applications include four general categories of wafers: prime, epitaxial, test/monitor and silicon-on-insulator (SOI) wafers.
The Company�� prime wafer is a polished, pure wafer with an ultraflat and ultraclean surface. The Company�� epitaxial (epi), wafers consist of a thin silicon layer grown on the polished surface of the wafer. Typically, the epitaxial layer has different electrical properties from the underlying wafer. This provides customers with isolation between circuit elements than a polished wafer. Its AEGIS product is designed for certain specialized applications requiring high resis! tivity epitaxial wafers and its MDZ product feature. The AEGIS wafer includes a thin epitaxial layer grown on a standard starting wafer. The AEGIS wafer�� thin epitaxial layer eliminates harmful defects on the surface of the wafer, thereby allowing device manufacturers to increase yields. The Company supplies test/monitor wafers to its customers for use in testing semiconductor fabrication lines and processes. An SOI wafer is a different starting material for the chip making process.
Solar Energy
The Company�� Solar Energy segment provides solar energy services that integrate the design, installation, financing, monitoring, operations and maintenance portions of the downstream solar market to provide a solar energy service to its customers. As of December 31, 2012, SunEdison interconnected over 675 solar power systems representing 989 megawatt of solar energy generating capacity. As of December 31, 2012, SunEdison had 73 megawatt of projects under construction and 2.6 gigawatts in pipeline. In support of its downstream solar business, its Solar Energy segment manufactures polysilicon, silicon wafers and solar modules. Additionally, its Solar Energy segment will sell solar modules to third parties in the event the opportunity aligns with itsinternal needs. It provides its downstream customers with a way to purchase renewable energy by delivering solar power under long-term power purchase arrangements with customers or feed-in tariff arrangements with government entities and utilities. Its SunEdison business is dependent upon government subsidies, including United States federal incentive tax credits, state-sponsored energy credits and foreign feed-in tariffs. The Company�� solar wafers are used as the starting material for crystalline solar cells.
The Company competes with Shin-Etsu Handotai, SUMCO, Siltronic and LG Siltron, SunPower Corporation, First Solar, Inc., Enerparc, Sharp Corporation (Recurrent Energy), Phoenix Solar, BELECTRIC, JUWI Solar Gmbh, and S! olar City! .
Advisors' Opinion:- [By Lauren Pollock]
SunEdison Inc.(SUNE) said Monday it will move its semiconductor crystal operations out of the U.S. and close its polysilicon manufacturing facility in Merano, Italy, which will affect more than 300 employees.
- [By Travis Hoium]
MEMC Electronic Materials (NYSE: SUNE ) is also transitioning from a solar supplier to a project builder, adding competition to the business. MEMC also has a larger 2.7 GW pipeline, although it doesn't have the same history in utility-scale projects as First Solar.
Best Semiconductor Companies To Watch For 2015: Malaysian Pacific Industries Bhd (MPI)
Malaysian Pacific Industries Berhad (MPI) is an investment holding company. The principal activities of MPI, through its subsidiaries are manufacturing, assembling, testing and sale of integrated circuits, semiconductor devices, electronic components and lead frames to customers globally. The Company�� operating geographical segments include Asia, The United States of America, and Europe. The Company's subsidiaries include Carsem (M) Sdn Bhd, Recams Sdn Bhd, Carsem Holdings Limited, Carsem Semiconductor (Suzhou) Co., Ltd, Dynacraft Industries Sdn Bhd, Carter Realty Sdn Bhd, Carter Realty Sdn Bhd and Carsem Holdings (HK) Limited. Advisors' Opinion:- [By Sofia Horta e Costa]
Michael Page International Plc (MPI) increased 1.1 percent to 490.2 pence after Goldman Sachs Group Inc. upgraded the stock to buy from neutral, saying the recruitment firm will benefit from a pick-up in the European economy.
Best Semiconductor Companies To Watch For 2015: Micropac Industries Inc (MPAD)
Micropac Industries, Inc. (Micropac), incorporated on March 3, 1969, manufactures and distributes various types of hybrid microelectronic circuits, solid state relays, power operational amplifiers, and optoelectronic components and assemblies. Micropac�� products are used as components in a range of military, space and industrial systems, including aircraft instrumentation and navigation systems, power supplies, electronic controls, computers, medical devices, and high-temperature (200o degree Celsius) products. The Company�� products are either custom (being application-specific circuits designed and manufactured to meet the particular requirements of a single customer) or standard components. During the fiscal year ended December 31, 2011 (fiscal 2011), its custom-designed components accounted for approximately 34% of its revenue and standard components accounted for approximately 66% of its revenue.
Micropac occupies approximately 36,000 square feet of manufacturing, engineering and office space in Garland, Texas. The Company owns 31,200 square feet of that space and leases an additional 4,800 square feet. It also sub-contracts some manufacturing to Inmobiliaria San Jose De Ciuddad Juarez S.A. DE C.V, a maquila contract manufacturer in Juarez, Mexico.
Micropac provides microelectronic and optoelectronic components and assemblies along with contract electronic manufacturing services, and offers a range of products sold to the industrial, medical, military, aerospace and space markets. The Microcircuits product line includes custom microcircuits, solid state relays, power operational amplifiers, and regulators. During fiscal 2011, microcircuits product line accounted for 51% of its revenue and the optoelectronics product line accounted for 62% of its business respectively. The Company�� core technology is the packaging and interconnects of miniature electronic components, utilizing thick film and thin film substrates, forming microelectronics circuits. Other technologi! es include light emitting and light sensitive materials and products, including light emitting diodes and silicon phototransistors used in its optoelectronic components, and assemblies.
The Company�� basic products and technologies include custom design hybrid microelectronic circuits, solid state relays and power controllers, custom optoelectronic assemblies and components, optocouplers, light-emitting diodes, Hall-Effect devices, displays, power operational amplifiers, fiber optic components and assemblies, and high temperature (200o degree Celsius) products. Micropac�� products are primarily sold to original equipment manufacturers (OEM��) who serve major markets, which includes military/aerospace, such as aircraft instrumentation, guidance and navigations systems, control circuitry, power supplies and laser positioning; space, which include control circuitry, power monitoring and sensing, and industrial, which includes power control equipment and robotics.
The Company�� products are marketed throughout the United States and in Western Europe. During fiscal 2011, approximately 21% of the Company�� revenue was from international customers. The Company�� major customers include contractors to the United States Government. During fiscal 2010, sales to these customers for the Department of Defense (DOD) and National Aeronautics and Space Administration (NASA) contracts accounted for approximately 62% of its revenues. The Company�� customers are Lockheed Martin, Northrop Grumman, Boeing, Rockwell Int��, and NASA.
The Company compete with Teledyne Industries, Inc., MS Kennedy, Honeywell, Avago and International Rectifier.
Advisors' Opinion:- [By Geoff Gannon] strong>ADDvantage Technologies (AEY)
路 Solitron Devices (SODI)
路 OPT-Sciences (OPST)
Micropac
Micropac is 76% owned by Heinz-Werner Hempel. He�� a German businessman. You can see the German company he founded here. He�� had control of Micropac for a long-time. I don�� have an exact number in front of me. But I would guess it�� been something like 25 years.
ADDvantage
ADDvantage Technologies is controlled by the Chymiak brothers. See the company�� April 4 press release explaining their decision to turn over the CEO position to an outsider. Regardless, the Chymiaks still control 47% of the company. Ken Chymiak is now chairman. And David Chymiak is still a director and now the company�� chief technology officer. Clearly, it�� still their company.
By the way, the name ADDvantage Technologies has nothing to do with the Chymiaks. Today�� AEY really traces its roots to a private company called Tulsat. The Chymiak brothers acquired that company about 27 years ago. So, effectively, when you buy shares of AEY you are buying into a 27-year-old family-controlled company.
That�� pretty typical in the world of net-nets.
Solitron
Solitron Devices is 29% owned by Shevach Saraf. He has been the CEO for 20 years. The post-bankruptcy Solitron has never known another CEO. Before the bankruptcy, Solitron was a much bigger, much different company. So even though we are not talking about the founder here ��and even though 70% of the company�� shares are not held by the CEO ��we��e still talking about a company where one person has a lot of control. Solitron only has three directors. Saraf is the chairman, CEO, president, CFO and treasurer. Neither of the other two directors joined the board within the last 15 years. So, we aren�� talking about a lot of tumult at the top.
In fact, profitable net-nets seem to be especially common candidates for abandoning the responsibilities of a public comp
No comments:
Post a Comment